Portable electronic device, image-capturing module thereof and carrier assembly thereof

ABSTRACT

The present invention provides a portable electronic device, and an image-capturing module thereof and a carrier assembly thereof. The image-capturing module includes a circuit substrate, an image-sensing chip, at least one electronic component, a package structure, and a lens assembly. The circuit substrate has a top surface and a bottom surface. The image-sensing chip is electrically connected to the circuit substrate, and the image-sensing chip has an image-sensing area. The at least one electronic component is disposed on the bottom surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the bottom surface of the circuit substrate to cover the at least one electronic component. The lens assembly includes a holder structure disposed on the top surface of the circuit substrate and a lens structure held by the holder structure and corresponding to the image-sensing area.

FIELD OF THE INVENTION

The present disclosure relates to a portable electronic device, animage-capturing module thereof and a carrier assembly thereof, and moreparticularly to a portable electronic device, an image-capturing modulethereof and a carrier assembly thereof for decreasing a width of a lensholder.

BACKGROUND OF THE INVENTION

The advantages of CMOS (Complementary Metal-Oxide-Semiconductor) are lowpower consumption and small size, thus allowing the CMOS sensor packagemodule to be integrated into portable electronic devices with small sizesuch as mobile phones and notebooks. However, a width of a lens holderof the CMOS sensor package module cannot be decreased due to electroniccomponents that are disposed on a PCB of the CMOS sensor package module.

SUMMARY OF THE INVENTION

One aspect of the present disclosure relates to a portable electronicdevice, an image-capturing module thereof and a carrier assemblythereof.

One of the embodiments of the present disclosure provides animage-capturing module, including a circuit substrate, an image-sensingchip, at least one electronic component, a package structure, and a lensassembly. The circuit substrate has a top surface and a bottom surface.The image-sensing chip is electrically connected to the circuitsubstrate, and the image-sensing chip has an image-sensing area. The atleast one electronic component is disposed on the bottom surface of thecircuit substrate and electrically connected to the circuit substrate.The package structure is disposed on the bottom surface of the circuitsubstrate to cover the at least one electronic component. The lensassembly includes a holder structure disposed on the top surface of thecircuit substrate and a lens structure held by the holder structure andcorresponding to the image-sensing area.

More particularly, the image-capturing module further includes at leastone conductive body disposed on the bottom surface of the circuitsubstrate and electrically connected to the circuit substrate, the atleast one conductive body being partially covered by the packagestructure, and a bottom surface of the at least one conductive body isexposed out of the package structure. The package structure has aflattening surface flush with the bottom surface of the at least oneconductive body, the package structure surrounds the image-sensing chip,and the thickness of the package structure is greater than the thicknessof the image-sensing chip. The circuit substrate has an unoccupied areathat is disposed on the top surface thereof and surrounded by the holderstructure.

More particularly, the image-capturing module further includes aheat-dissipating structure disposed on the flattening surface of thepackage structure for contacting the bottom surface of the at least oneconductive body, and the image-sensing chip is adhered to theheat-dissipating structure through an adhesive. The circuit substratehas a through opening connected between the top surface and the bottomsurface of the circuit substrate, the image-sensing chip is disposed onthe bottom surface of the circuit substrate, and the image-sensing areaof the image-sensing chip faces the through opening of the circuitsubstrate.

More particularly, the image-capturing module further includes a filterelement disposed on one of the circuit substrate and the image-sensingchip, and the filter element is disposed between the image-sensing chipand the lens structure. The package structure has a single package bodysurrounding the image-sensing chip and a receiving space passing throughthe single package body and being communicated with the through opening,and the whole image-sensing chip is received inside the receiving spaceof the package structure.

Another one of the embodiments of the present disclosure provides acarrier assembly, including a circuit substrate, a package structure,and a holder structure. The circuit substrate is used for carrying atleast one electronic component. The circuit substrate has a top surfaceand a bottom surface, and the at least one electronic component isdisposed on the bottom surface of the circuit substrate and electricallyconnected to the circuit substrate. The package structure is disposed onthe bottom surface of the circuit substrate to cover the at least oneelectronic component, and the holder structure is disposed on the topsurface of the circuit substrate.

Yet another one of the embodiments of the present disclosure provides aportable electronic device using an image-capturing module,characterized in that the image-capturing module includes a circuitsubstrate, an image-sensing chip, at least one electronic component, apackage structure, and a lens assembly. The circuit substrate has a topsurface and a bottom surface. The image-sensing chip is electricallyconnected to the circuit substrate, and the image-sensing chip has animage-sensing area. The at least one electronic component is disposed onthe bottom surface of the circuit substrate and electrically connectedto the circuit substrate. The package structure is disposed on thebottom surface of the circuit substrate to cover the at least oneelectronic component. The lens assembly includes a holder structuredisposed on the top surface of the circuit substrate and a lensstructure held by the holder structure and corresponding to theimage-sensing area.

Therefore, the horizontal width or the horizontal size of the holderstructure can be decreased by matching the features of “the at least oneelectronic component being disposed on the bottom surface of the circuitsubstrate and electrically connected to the circuit substrate, and thepackage structure being disposed on the top surface of the circuitsubstrate to cover the at least one electronic component” and “theholder structure being disposed on the top surface of the circuitsubstrate”.

To further understand the techniques, means and effects of the presentdisclosure, the following detailed descriptions and appended drawingsare hereby referred to, such that, and through which, the purposes,features and aspects of the present disclosure can be thoroughly andconcretely appreciated. However, the appended drawings are providedsolely for reference and illustration, without any intention to limitthe present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the present disclosure, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the present disclosure and, together with thedescription, serve to explain the principles of the present disclosure.

FIG. 1 shows a schematic view of an image-capturing module according tothe first embodiment of the present disclosure;

FIG. 2 shows a schematic view of the image-capturing module according tothe second embodiment of the present disclosure;

FIG. 3 shows a schematic view of the image-capturing module according tothe third embodiment of the present disclosure;

FIG. 4 shows a schematic view of a carrier assembly according to thepresent disclosure;

FIG. 5 shows a schematic view of the image-capturing module according tothe fourth embodiment of the present disclosure;

FIG. 6 shows a schematic view of the image-capturing module according tothe fifth embodiment of the present disclosure;

FIG. 7 shows a schematic view of the image-capturing module according tothe sixth embodiment of the present disclosure;

FIG. 8 shows a schematic view of the image-capturing module according tothe seventh embodiment of the present disclosure; and

FIG. 9 shows a schematic view of a portable electronic device accordingto the eighth embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of a portable electronic device, an image-capturing modulethereof and a carrier assembly thereof according to the presentdisclosure are described herein. Other advantages and objectives of thepresent disclosure can be easily understood by one skilled in the artfrom the disclosure. The present disclosure can be applied in differentembodiments. Various modifications and variations can be made to variousdetails in the description for different applications without departingfrom the scope of the present disclosure. The drawings of the presentdisclosure are provided only for simple illustrations, but are not drawnto scale and do not reflect the actual relative dimensions. Thefollowing embodiments are provided to describe in detail the concept ofthe present disclosure, and are not intended to limit the scope thereofin any way.

First Embodiment

Referring to FIG. 1, the first embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5.

First, the circuit substrate 1 has a top surface 101 and a bottomsurface 102. More particularly, the circuit substrate 1 has a throughopening 100 connected between the top surface 101 and the bottom surface102 of the circuit substrate 1. For example, the circuit substrate 1 maybe a PCB rigid board (such as BT, FR4, or FR5 etc.), a rigid-flex board,or a ceramic board, etc., but it is not meant to limit the scope of thepresent disclosure.

Moreover, the image-sensing chip 2 is electrically connected to thecircuit substrate 1, and the image-sensing chip 2 has an image-sensingarea 200. More particularly, the image-sensing chip 2 is disposed on thebottom surface 102 of the circuit substrate 1, and the image-sensingarea 200 of the image-sensing chip 2 can face the through opening 100 ofthe circuit substrate 1. For example, the image-sensing chip 2 may be aCMOS (Complementary Metal-Oxide-Semiconductor) sensor or any kind ofimage sensor that can be used for capturing images, but it is not meantto limit the scope of the present disclosure.

Furthermore, the at least one electronic component 3 is disposed on thebottom surface 102 of the circuit substrate 1 and electrically connectedto the circuit substrate 1. For example, the at least one electroniccomponent 3 may be a passive component such as a capacitor, a resistor,a drive IC, or an EEPROM, but it is not meant to limit the scope of thepresent disclosure.

In addition, the package structure 4 is disposed on the bottom surface102 of the circuit substrate 1 to cover the at least one electroniccomponent 3. More particularly, the package structure 4 has a singlepackage body 41 (such as a surrounding encapsulation body) surroundingthe image-sensing chip 2 and a receiving space 42 (such as a throughhole) passing through the single package body 41 and being communicatedwith the through opening 100 of the circuit substrate 1. For example,the package structure 4 can be formed as a molding base by molding, andthe package structure 4 has a micrometer flattening surface 400 formedby fine grinding, but it is not meant to limit the scope of the presentdisclosure.

It should be noted that the package structure 4 is disposed on thebottom surface 102 of the circuit substrate 1 so as to increase thestructural strength of the circuit substrate 1 due to the support of thepackage structure 4, so that the rigidity of the circuit substrate 1 canbe increased without causing warpage.

Moreover, the lens assembly 5 includes a holder structure 51 (i.e., alens holder) disposed on the top surface 101 of the circuit substrate 1and a lens structure 52 being held or supported by the holder structure51 and corresponding to the image-sensing area 200 of the image-sensingchip 2. For example, the holder structure 51 may be a fixed seat or avoice coil motor (VCM), and the lens structure 52 may be composed ofmany lenses, but they are not meant to limit the scope of the presentdisclosure. In addition, for example, the holder structure 51 can bedisposed on the top surface 101 of the circuit substrate 1 through anadhesive paste (not shown), but it is not meant to limit the scope ofthe present disclosure.

It should be noted that the circuit substrate 1 has an unoccupied area1010 (such as a non-component region) that is disposed on the topsurface 101 thereof and surrounded by the holder structure 51. That isto say, all of the electronic components (such as the at least oneelectronic component 3) are disposed on the bottom surface 102 of thecircuit substrate 1, so that there is no any electronic componentdisposed on the unoccupied area 1010 of the top surface 101 of thecircuit substrate 1. Therefore, the holder structure 51 can be disposedon the unoccupied area 1010 of the top surface 101 of the circuitsubstrate 1.

It should be noted that the image-capturing module M further includes afilter element 6 disposed on one of the circuit substrate 1 and theimage-sensing chip 2, and the filter element 6 is disposed between theimage-sensing chip 2 and the lens structure 52. For example, the filterelement 6 can be disposed on the image-sensing chip 2 (as shown in FIG.1), or the filter element 6 can be supported above the image-sensingchip 2 through spacers (not shown). In addition, the filter element 6may be a coated glass or a non-coated glass, but it is merely an exampleand is not meant to limit the scope of the present disclosure.

It should be noted that the package structure 4 further has a protectionlayer formed on the outer surface thereof. For example, the packagestructure 4 has a dustproof coating disposed on the outer surfacethereof so as to prevent dust particles from being attached to thepackage structure 4, but it is not meant to limit the scope of thepresent disclosure.

In conclusion, the holder structure 51 and the electronic component 3are disposed on two opposite surfaces of the circuit substrate 1, sothat the horizontal width or the horizontal size of the holder structure51 can be decreased. That is to say, the holder structure 51 can bedisposed on the unoccupied area 1010 of the top surface 101 of thecircuit substrate 1 without moving away horizontally from the electroniccomponent 3, so that the horizontal width (i.e., the width in ahorizontal direction, such as X direction width or Y direction width) ofthe holder structure 51 can be decreased, or the horizontal size (i.e.,the size in a horizontal direction) of the holder structure 51 can bedecreased.

Second Embodiment

Referring to FIG. 2, the second embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5. Comparing FIG. 2 with FIG. 1, thedifference between the second embodiment and the first embodiment is asfollows: in the second embodiment, the image-capturing module M furtherincludes at least one conductive body 7 disposed on the bottom surface102 of the circuit substrate 1 and electrically connected to the circuitsubstrate 1.

As described above, the at least one conductive body 7 is partiallycovered by the package structure 4, and a bottom surface 700 of the atleast one conductive body 7 is exposed out of the package structure 4.For example, the at least one conductive body 7 is electricallyconnected to a ground area 103 of the circuit substrate 1, and theground area 103 of the circuit substrate 1 can be electrically connectedto a ground area of an application system (not shown) through the atleast one conductive body 7, so that the image-capturing module M canprovide electrostatic discharge (ESD) and electromagnetic disturbance(EMI) functions according to different requirements. In addition, the atleast one conductive body 7 may be a conductive element such as copperpillar, solder ball, or an electronic component etc., but it is merelyan example and is not meant to limit the scope of the presentdisclosure.

It should be noted that the package structure 4 is disposed on thebottom surface 102 of the circuit substrate 1 to surround theimage-sensing chip 2, and the thickness H1 of the package structure 4 isgreater than the thickness H2 of the image-sensing chip 2. Therefore,the thickness H1 of the package structure 4 is greater than thethickness H2 of the image-sensing chip 2, so that the distance from thetop side of the package structure 4 to the bottom surface 102 of thecircuit substrate 1 is greater than the distance from the top side ofthe image-sensing chip 2 to the bottom surface 102 of the circuitsubstrate 1. The whole image-sensing chip 2 can be received inside thereceiving space 42 of the package structure 4, so that the packagestructure 4 can be used to protect the image-sensing chip 2 and preventthe image-sensing chip 2 from collision with foreign objects.

Third Embodiment

Referring to FIG. 3, the third embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5. Comparing FIG. 3 with FIG. 2, thedifference between the third embodiment and the second embodiment is asfollows: in the third embodiment, the filter element 6 is directlydisposed on the circuit substrate 1 and spaced apart from theimage-sensing chip 2.

That is to say, the filter element 6 can be disposed on theimage-sensing chip 2 (as shown in the first embodiment in FIG. 1), orthe circuit substrate 1 (as shown in the third embodiment in FIG. 3)according to different requirements.

It should be noted that the present invention further provides a carrierassembly S, including a circuit substrate 1, a package structure 4, anda holder structure 51 as shown in FIG. 4. The circuit substrate 1 can beused for carrying at least one electronic component 3, and the at leastone electronic component 3 is disposed on the bottom surface 102 of thecircuit substrate 1 and electrically connected to the circuit substrate1. The package structure 4 is disposed on the bottom surface 102 of thecircuit substrate 1 to cover or enclose the at least one electroniccomponent 3, and the holder structure 51 is disposed on the top surface101 of the package structure 4.

That is to say, the carrier assembly S as shown in FIG. 4 can also beused for purposes other than carrying the image-sensing chip 2 and thelens structure 52 as shown in the first to the third embodiments.

Fourth Embodiment

Referring to FIG. 5, the fourth embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5. Comparing FIG. 5 with FIG. 2, thedifference between the fourth embodiment and the second embodiment is asfollows: in the fourth embodiment, the image-capturing module M furtherincludes a heat-dissipating structure 8 disposed on the flatteningsurface 400 of the package structure 4 for contacting the bottom surface700 of the at least one conductive body 7.

As described above, the image-sensing chip 2 can be adhered to theheat-dissipating structure 8 through an adhesive (not labeled) so as toincrease the heat-dissipating efficiency of the image-sensing chip 2. Inaddition, the package structure 4 has a flattening surface 400 flushwith the bottom surface 700 of the at least one conductive body 7, sothat the flattening surface 400 can be used as a carrier base forcarrying the heat-dissipating structure 8. For example, theheat-dissipating structure 8 may be a conductive element such as a steelplate, a copper sheet, or a copper foil, etc., but it is not meant tolimit the scope of the present disclosure.

It should be noted that the at least one conductive body 7 iselectrically connected to a ground area 103 of the circuit substrate 1,and the ground area 103 of the circuit substrate 1 can be electricallyconnected to a ground area of an application system (not shown) throughthe at least one conductive body 7 and the heat-dissipating structure 8in sequence, so that the image-capturing module M can provideelectrostatic discharge (ESD) and electromagnetic disturbance (EMI)functions according to different requirements

Fifth Embodiment

Referring to FIG. 6, the fifth embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5. Comparing FIG. 6 with FIG. 2, thedifference between the fifth embodiment and the second embodiment is asfollows: in the fifth embodiment, the circuit substrate 1 furtherincludes an electrical connector C1, so that the image-capturing moduleM can be electrically connected to a terminal electronic module (notshown) through the electrical connector C1.

Sixth Embodiment

Referring to FIG. 7, the sixth embodiment of the present disclosureprovides an image-capturing module M, including a circuit substrate 1,an image-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5. Comparing FIG. 7 with FIG. 2, thedifference between the sixth embodiment and the second embodiment is asfollows: in the sixth embodiment, the image-capturing module M can beelectrically bonded on a flexible PCB (not labeled) through a conductivestructure C2 (such as hot bar or ACF), so that the image-capturingmodule M can be electrically connected to a terminal electronic module(not shown) through the flexible PCB. Therefore, the image-capturingmodule M can be electrically bonded on different flexible PCBs (notlabeled) through the conductive structure C2 according to differentrequirements so as to increase the shareability of the image-capturingmodule M.

Seventh Embodiment

Referring to FIG. 8, the seventh embodiment of the present disclosureprovides two image-capturing modules M. Comparing FIG. 8 with FIG. 2,the difference between the seventh embodiment and the second embodimentis as follows: the seventh embodiment can use two image-capturingmodules M (i.e., a dual camera) at the same time, and the twoimage-capturing modules M can share the same package structure 4 and thesame conductive body 7 according to different requirements.

Eighth Embodiment

Referring to FIG. 9, the eighth embodiment of the present disclosureprovides a portable electronic device P using an image-capturing moduleM of any one of the first to the seventh embodiments. For example, theelectronic device P may be a smart phone, a laptop, or a tabletcomputer, but it is not meant to limit the scope of the presentdisclosure. As shown in FIG. 9, the image-capturing module M can be usedas a rear lens of the portable electronic device P, and theimage-capturing module M includes a circuit substrate 1, animage-sensing chip 2, at least one electronic component 3, a packagestructure 4, and a lens assembly 5, but it is merely an example and isnot meant to limit the scope of the present disclosure.

Therefore, the horizontal width or the horizontal size of the holderstructure 51 can be decreased by matching the features of “the at leastone electronic component 3 being disposed on the bottom surface 102 ofthe circuit substrate 1 and electrically connected to the circuitsubstrate 1, and the package structure 4 being disposed on the bottomsurface 102 of the circuit substrate 1 to cover the at least oneelectronic component 3” and “the holder structure 51 being disposed onthe top surface 101 of the circuit substrate 1”. That is to say, theholder structure 51 can be disposed on the unoccupied area 1010 of thetop surface 101 of the circuit substrate 1 without horizontally movingaway from the electronic component 3, so that the horizontal width(i.e., the width in a horizontal direction, such as X direction width orY direction width) of the holder structure 51 can be decreased, or thehorizontal size (i.e., the size in a horizontal direction) of the holderstructure 51 can be decreased.

It should be noted that the package structure 4 is disposed on thebottom surface 102 of the circuit substrate 1 so as to increase thestructural strength of the circuit substrate 1 due to the support of thepackage structure 4, so that the rigidity of the circuit substrate 1 canbe increased without causing warpage.

The aforementioned descriptions merely represent the preferredembodiments of the present disclosure, without any intention to limitthe scope of the present disclosure which is fully described only withinthe following claims. Various equivalent changes, alterations ormodifications based on the claims of the present disclosure are all,consequently, viewed as being embraced by the scope of the presentdisclosure.

1. An image-capturing module, comprising: a circuit substrate having atop surface and a bottom surface; an image-sensing chip disposed on thebottom surface of the circuit substrate and electrically connected tothe circuit substrate, wherein the image-sensing chip has animage-sensing area; at least one electronic component disposed on thebottom surface of the circuit substrate and electrically connected tothe circuit substrate; a package structure disposed on the bottomsurface of the circuit substrate to cover the at least one electroniccomponent; and a lens assembly including a holder structure disposed onthe top surface of the circuit substrate and a lens structure being heldby the holder structure and corresponding to the image-sensing area,wherein the package structure surrounds the image-sensing chip, and athickness of the package structure is greater than a thickness of theimage-sensing chip.
 2. The image-capturing module of claim 1, furthercomprising at least one conductive body disposed on the bottom surfaceof the circuit substrate and electrically connected to the circuitsubstrate, the at least one conductive body being partially covered bythe package structure, and a bottom surface of the at least oneconductive body being exposed out of the package structure, wherein thepackage structure has a flattening surface flush with the bottom surfaceof the at least one conductive body, and wherein the circuit substratehas an unoccupied area that is disposed on the top surface thereof andsurrounded by the holder structure.
 3. The image-capturing module ofclaim 2, further comprising a heat-dissipating structure disposed on theflattening surface of the package structure for contacting the bottomsurface of the at least one conductive body, and the image-sensing chipbeing adhered to the heat-dissipating structure through an adhesive,wherein the circuit substrate has a through opening connected betweenthe top surface and the bottom surface of the circuit substrate, and theimage-sensing area of the image-sensing chip faces the through openingof the circuit substrate.
 4. The image-capturing module of claim 3,further comprising a filter element disposed on one of the circuitsubstrate and the image-sensing chip, and the filter element beingdisposed between the image-sensing chip and the lens structure, whereinthe package structure has a single package body surrounding theimage-sensing chip and a receiving space passing through the singlepackage body and being communicated with the through opening, and thewhole image-sensing chip is received inside the receiving space of thepackage structure.
 5. A carrier assembly, comprising: a circuitsubstrate for carrying at least one electronic component, wherein thecircuit substrate has a top surface and a bottom surface, and the atleast one electronic component is disposed on the bottom surface of thecircuit substrate and electrically connected to the circuit substrate; apackage structure disposed on the bottom surface of the circuitsubstrate to cover the at least one electronic component; a holderstructure disposed on the top surface of the circuit substrate; and animage-sensing chip disposed on the bottom surface of the circuitsubstrate, wherein the package structure surrounds the image-sensingchip, and a thickness of the package structure is greater than athickness of the image sensing chip.
 6. The carrier assembly of claim 5,further comprising: at least one conductive body; and a heat-dissipatingstructure; wherein the at least one conductive body is disposed on thebottom surface of the circuit substrate and electrically connected tothe circuit substrate, the at least one conductive body is partiallycovered by the package structure, and a bottom surface of the at leastone conductive body is exposed out of the package structure; wherein thepackage structure has a flattening surface flush with the bottom surfaceof the at least one conductive body, the heat-dissipating structure isdisposed on the flattening surface of the package structure forcontacting the bottom surface of the at least one conductive body;wherein the circuit substrate has an unoccupied area that is disposed onthe top surface thereof and surrounded by the holder structure.
 7. Aportable electronic device using an image-capturing module,characterized in that the image-capturing module comprises: a circuitsubstrate having a top surface and a bottom surface; an image-sensingchip disposed on the bottom surface of the circuit substrate andelectrically connected to the circuit substrate, wherein theimage-sensing chip has an image-sensing area; at least one electroniccomponent disposed on the bottom surface of the circuit substrate andelectrically connected to the circuit substrate; a package structuredisposed on the bottom surface of the circuit substrate to cover the atleast one electronic component; and a lens assembly including a holderstructure disposed on the top surface of the circuit substrate and alens structure being held by the holder structure and corresponding tothe image-sensing area, wherein the package structure surrounds theimage-sensing chip, and a thickness of the package structure is greaterthan a thickness of the image-sensing chip.
 8. The portable electronicdevice of claim 7, wherein the image-capturing module includes at leastone conductive body disposed on the bottom surface of the circuitsubstrate and electrically connected to the circuit substrate, the atleast one conductive body is partially covered by the package structure,and a bottom surface of the at least one conductive body is exposed outof the package structure, wherein the package structure has a flatteningsurface flush with the bottom surface of the at least one conductivebody, and wherein the circuit substrate has an unoccupied area that isdisposed on the top surface thereof and surrounded by the holderstructure.
 9. The portable electronic device of claim 8, wherein theimage-capturing module includes a heat-dissipating structure disposed onthe flattening surface of the package structure for contacting thebottom surface of the at least one conductive body, and theimage-sensing chip is adhered to the heat-dissipating structure throughan adhesive, and wherein the circuit substrate has a through openingconnected between the top surface and the bottom surface of the circuitsubstrate, and the image-sensing area of the image-sensing chip facesthe through opening of the circuit substrate.
 10. The portableelectronic device of claim 9, wherein the image-capturing moduleincludes a filter element disposed on one of the circuit substrate andthe image-sensing chip, and the filter element is disposed between theimage-sensing chip and the lens structure, and wherein the packagestructure has a single package body surrounding the image-sensing chipand a receiving space passing through the single package body and beingcommunicated with the through opening, and the whole image-sensing chipis received inside the receiving space of the package structure.